The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
Wafer or Strip Tape mounting Dicing Cleaning UV seperation
Description of Semi-auto dicing
The semi-auto dicing system, refers to a dicing system that loader and unloader by hand and only the procedure is automated in the process of dicing. The system is not equipped with automatic cleaning, drying, etc.
Feeding by hand Position align Auto-cutting Unloading by hand
1.Operator manually place the material being cut on work platform.
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Ceramic substrate Silicon rubber Lead frame
Silicon wafer PCB Glass
1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.
Semi-dicing system YSL-1000SD Features of products
1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
2.Can meet the high precision cutting maximum diameter of 300 mm materials.
3.High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
4.CCD automatic align.
5.Real-time monitoring of the system's air pressure, water pressure, current and other values to avoid spindle damage.
6.Cutting Spindle : 2.4 kw × 1set (Max: 60,000 rpm)
7.Repeat positioning accuracy: 0.001mm
8.Cutting speed: 0.05 ~ 400 mm/sec
9.Standard matching blade: 2 Inch (Max: 3 Inch)
1.Function of blade damage detection;
2.Automatic setting function;
3.Dicing visual function;
4. Using dicing blade with 3 Inch.
Ordinary 8 inch working platform can only put 2pcs material.
SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
1.Reduce the loading times;
2.Meet the larger size of the product;
3.Promote more than 8% efficiency.
|Dimensions of processing||mm||Φ300|
|Dimensions of working platform||mm||Φ350|
|Cutting speed||mm/sec||0.05 ~ 400|
|Repeat positioning accuracy||mm||0.001 / 310|
|Z-axis||Working stroke||mm||60 (2 Inch blade)|
|Θ-axis||Angle of rotation||Deg||360|
|Speed||Rpm||5000 ~ 60000|
|Machine’s specifications||Power supply||V||3P 220 (50 ~ 60 Hz)|
|Power air pressure||MPa||0.5 ~ 0.6|
|Cutting water consumption||L/min||4|
|Cooling water consumption||L/min||1.5|
|Machine net weight||KG||850|