제품 세부 사항
원래 장소: 중국
브랜드 이름: YUSH
모델 번호: YS-820L
지불 및 배송 조건
최소 주문 수량: 1SET
가격: USD26000
포장 세부 사항: 우드인케이스
배달 시간: 30일
지불 조건: L/C,D/A,D/P,T/T
공급 능력: 100세트
무게: |
630KG |
전원 공급: |
AC220V=10%, 단상 50/60Hz |
급기: |
0.5mpa,70cm3/분 |
운영 시스템: |
마이크로소프트 윈도우 10 |
치수(W×D*H, 타워라이트 제외): |
1148 × 1262 × 1660mm |
작업 환경: |
온도 10-40 0. humidity 30-80%RH |
PCB 사이즈: |
50*50mm~510*460mm |
PCB 두께: |
0.5-5.0mm |
PCB 뒤틀림 공차: |
±2mm |
무게: |
630KG |
전원 공급: |
AC220V=10%, 단상 50/60Hz |
급기: |
0.5mpa,70cm3/분 |
운영 시스템: |
마이크로소프트 윈도우 10 |
치수(W×D*H, 타워라이트 제외): |
1148 × 1262 × 1660mm |
작업 환경: |
온도 10-40 0. humidity 30-80%RH |
PCB 사이즈: |
50*50mm~510*460mm |
PCB 두께: |
0.5-5.0mm |
PCB 뒤틀림 공차: |
±2mm |
PRODUCT FEATURES:
1. Vector analysis algorithm,integrated variety of software algorithms to achieve the best inspection capability
2.Offline programming and debugging.
3.The equipment can communicate directly with the NG BUFFER device and other equipment through the communication protocol.
FUNCTION MODULE:
1.Al Intelligent Recognition and various vector image algorithms to get the best inspection capability
By using Al to automatically build a database,automatically configure detection thresholds,and integrate traditional vector analysis algorithms,It can achieve efficient programming and optimal configuration of detection algorithms,thereby improving programming efficiency while ensuring detection capabilities.
|
CATEGORY |
ITEM |
S810/S820/S830 S810L/S820L/S830L |
|
RecognitionSystem |
Inspection |
AIIntellgent detectlon algorthmnt,he vectorimage algorthmsindudeloglc operaton,dstance of luminance bounday,chptrachg.OCR/OCV,uminancelclor emplate matc colordstance,color extractlon(RGB &HSV,value-range of luminance,offsat of luminance,the minimum variation span of luminance ate More than 30 kinds of the most advanced algorithms |
| Camera | 5MP7High performanoe 5MP712MP (20 and 25MP optional) | |
| Lens |
High-resolution telecentric Lens,20μm,15μm,12um,10μm,8μm for option |
|
|
Lamp-house |
Ring tower structure,high intensityRGBW flash lighting |
|
| FOV |
48.96×40.96 mm(5MP &20μm)/36.72×30.72 mm(5MP &15μm) 50×45mm(12MP&15μm)/40×30mm(12MP&10μm) |
|
|
0201 Chip |
<7.6ms | |
|
Per-image Time |
220～450ms | |
|
Paste Printing Defects |
Missing.overflow,insufficlent,pasting open,stain |
|
|
Component Defects |
Mssing.shift,skewed,tombstone,bllboard,overtumed,reversed polarity,wrong.damaged |
|
|
Solder Defects |
Overflow,insufficient,short solder,stain | |
|
WaveSokdering Inspect |
Overflow,insufficient,short,excess solder,solder void |
|
| Inspection tems | 0201&0.4mmpitch(20μm) 01005&0.3mm pitch(15μm) | |
|
Mechanism System |
PCB Conweyor |
Bottom to updlamping.Automatic PCB loading and unbading.automatic adjust the conveyor width,5MEMA standard communicationprotocol. Theconveyor height 900±20mm |
| PCB Size | 50×50mm~400×330mm 50×50mm~510×460mm | |
| PCB Thickness | 0.5-5.0mm | |
|
PCB Warp Tolerance |
±2mm | |
|
Component Clearance |
TOP≤30mm,BOT≤30mm | |
| Drver | AC servo system,camera moves inthe directions of XY | |
| Orlentation | <10μm | |
|
Mowing Speed |
Standard:500mm/s,Max800mm/s |
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