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High Precision Substrate CCD Drilling Machine For PCB Products

Détails du produit

Lieu d'origine: Guangdong

Nom de marque: YUSH

Certification: ce

Numéro de modèle: Supplémentaire D6-2530

Conditions de paiement et d'expédition

Quantité de commande min: 1

Prix: USD68500

Délai de livraison: 20 jours de travail

Conditions de paiement: LC, D/A, D/P, T/T, Western Union

Capacité d'approvisionnement: 1000

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High precision PCB drilling machine

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Substrate CCD drilling machine

,

PCB handling drilling equipment

Poids:
13600KG
Dimensions (l * w * h):
4600mm*2000mm*1590mm
Humidité:
50%-65%
Nombre d'axes:
6
Plage de taille des forages:
0.1mm-6.5mm
Vitesse maximale de la broche:
200 Krpm
Poids:
13600KG
Dimensions (l * w * h):
4600mm*2000mm*1590mm
Humidité:
50%-65%
Nombre d'axes:
6
Plage de taille des forages:
0.1mm-6.5mm
Vitesse maximale de la broche:
200 Krpm
High Precision Substrate CCD Drilling Machine For PCB Products
High Precision Substrate CCD Drilling Machine For PCB Products
Substrate CCD Drilling Machine
High Precision Substrate CCD Drilling Machine For PCB Products 0

This advanced drilling machine is specifically designed for high-precision PCB products including LED panels, optical communication module boards, HDI mobile phone boards, and aluminum server boards.

High Stability Performance
  • Germany SIEB & MEYER CNC 84.00 or 95.00 control system
  • Stable anti-interference optical fiber technology
  • Optimum operation via digital drive technology
  • X-axis with absolute linear scale, resolution up to 1 nm with strong resistance to dust pollution
Precision Drilling Capabilities
  • Auto fiducial mark recognition and registration algorithm for board stretch, shrink and tilting error compensation
  • IWS (Independent Work Station) Structure with offset, rotation, and scale compensation for each board
  • High-precision Blind Hole Processing Function with CBD Depth-controlled drilling accuracy: ±0.015mm (VEGA testing condition)
  • 3D back drilling technology (Optional) with back drill stub length control process capacity up to 2~6mil
  • See-Hole-Drill-Hole process scans through-holes with high-definition camera and individually compensates for each hole's offset
Technical Specifications
Machine Type D6-2530
X/Y Axis Velocity 90m/min
Z Axis Velocity 50m/min
Number of Axis 6
Max Speed of Spindle 200krpm
Drill Size Range 0.1mm-6.5mm
Tool Magazine Capacity 300
Spindle Maintenance Automatic chuck cleaning
Positioning Accuracy ±0.004mm
Repeatability Accuracy ±0.002mm
Drilling Accuracy ±0.017mm (testing condition)
Control Method CBD High Precision Control
Alignment System CCD High Definition Lens
Blind Drilling Accuracy ±0.015mm (testing condition)
Back Drilling Alignment D+3mil (testing condition)
Air Requirement 7-8bar
Cooling Requirement 17℃-20℃
Power Requirement 3PH-AC380V ±8%+PE, 50/60HZ 20KVA
Temperature 22±2℃
Humidity 50%-65%
Dimensions (L*W*H) 4600mm*2000mm*1590mm
Weight 13600kg