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Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control

Détails du produit

Lieu d'origine: Guangdong

Nom de marque: YUSH

Numéro de modèle: Le numéro de série

Conditions de paiement et d'expédition

Quantité de commande min: 1

Prix: USD25000

Délai de livraison: 20 jours ouvrables

Conditions de paiement: LC, D/A, D/P, T/T, Western Union

Capacité d'approvisionnement: 1000

Obtenez le meilleur prix
Mettre en évidence:

Lead Free Reflow Oven

,

High Efficiency Reflow Oven

,

Precision Temperature Control Reflow Oven

Modèle:
Le numéro de série
Pouvoir:
380V
Poids:
2000 kg
Modèle:
Le numéro de série
Pouvoir:
380V
Poids:
2000 kg
Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control
Industrial High Efficiency YS-F8 Lead Free Hot Air Reflow Oven
Precision SMT PCB Board Reflow Soldering Machinery designed for reliable, high-performance electronic assembly operations.
Advanced Control & Safety Features
  • Brand computer and Siemens PLC intelligent control system with ±1-2℃ high precision temperature control
  • Off-line operation capability ensures continuous production during computer system incidents
  • Windows XP operating interface for powerful yet simple operation
  • Automatic cylinder lift system for enhanced safety and reliability
  • Fault detection with sound and light alarm functionality
  • Leakage protector safeguards operating personnel and control systems
  • Built-in UPS and automatic delay shutdown system protects PCBs and equipment during power or overheating events
Precision Transport & Mechanical Systems
  • Mesh belt transport system ensures smooth, stable PCB movement without shaking or deformation
  • Synchronous guide transmission mechanism enables automatic SMT machine online connection
  • Adjustable guide width with high precision and extended service life
  • Automatic control lubrication system for transmission chain maintenance
Heating & Temperature Management
  • Computer PID control for all heating zones with independent upper and lower temperature zone management
  • Divided temperature area heating reduces starting power requirements
  • German ERSA microcirculation heating mode with independent upper and lower air microcirculation systems
  • High-efficiency supercharged accelerated air duct improves circulating hot air flow
  • Rapid heat-up time (approximately twenty minutes) with efficient thermal compensation
  • Independent temperature inductive sensors for each upper and lower temperature zone
  • Real-time monitoring and compensation for balanced temperature zone performance
  • Closed-loop computer control of net/chain transmission accommodates various PCB production requirements
Technical Specifications
Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 0 Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 1 Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 2