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Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control

Produktdetails

Herkunftsort: Guangdong

Markenname: YUSH

Modellnummer: YS-F8

Zahlungs- und Versandbedingungen

Min Bestellmenge: 1

Preis: USD25000

Lieferzeit: 20 Arbeitstage

Zahlungsbedingungen: L/C, D/A, D/P, T/T, Western Union

Versorgungsmaterial-Fähigkeit: 1000

Bestpreis erhalten
Hervorheben:

Lead Free Reflow Oven

,

High Efficiency Reflow Oven

,

Precision Temperature Control Reflow Oven

Modell:
YS-F8
Leistung:
380V
Gewicht:
2000kg
Modell:
YS-F8
Leistung:
380V
Gewicht:
2000kg
Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control
Industrial High Efficiency YS-F8 Lead Free Hot Air Reflow Oven
Precision SMT PCB Board Reflow Soldering Machinery designed for reliable, high-performance electronic assembly operations.
Advanced Control & Safety Features
  • Brand computer and Siemens PLC intelligent control system with ±1-2℃ high precision temperature control
  • Off-line operation capability ensures continuous production during computer system incidents
  • Windows XP operating interface for powerful yet simple operation
  • Automatic cylinder lift system for enhanced safety and reliability
  • Fault detection with sound and light alarm functionality
  • Leakage protector safeguards operating personnel and control systems
  • Built-in UPS and automatic delay shutdown system protects PCBs and equipment during power or overheating events
Precision Transport & Mechanical Systems
  • Mesh belt transport system ensures smooth, stable PCB movement without shaking or deformation
  • Synchronous guide transmission mechanism enables automatic SMT machine online connection
  • Adjustable guide width with high precision and extended service life
  • Automatic control lubrication system for transmission chain maintenance
Heating & Temperature Management
  • Computer PID control for all heating zones with independent upper and lower temperature zone management
  • Divided temperature area heating reduces starting power requirements
  • German ERSA microcirculation heating mode with independent upper and lower air microcirculation systems
  • High-efficiency supercharged accelerated air duct improves circulating hot air flow
  • Rapid heat-up time (approximately twenty minutes) with efficient thermal compensation
  • Independent temperature inductive sensors for each upper and lower temperature zone
  • Real-time monitoring and compensation for balanced temperature zone performance
  • Closed-loop computer control of net/chain transmission accommodates various PCB production requirements
Technical Specifications
Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 0 Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 1 Industrial High Efficiency Lead Free Hot Air Reflow Oven | Precision SMT PCB Reflow Soldering Machine with ±1-2℃ Control 2