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Casa > produtos > Sistema de inspecção visual > Universal X-Ray Inspection System,high Quality 3D Measurement and Non-destructive Analysis.
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Universal X-Ray Inspection System,high Quality 3D Measurement and Non-destructive Analysis.

Detalhes do produto

Place of Origin: Guangdong

Marca: YUSH

Model Number: YS-8500

Termos de pagamento e envio

Minimum Order Quantity: 1

Preço: USD50000

Delivery Time: 20 work days

Payment Terms: L/C,D/A,D/P,T/T,Western Union

Supply Ability: 1000

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Universal X-ray inspection system with 3D measurement

,

Automatic X-ray inspection for non-destructive analysis

,

High-quality X-ray inspection system with warranty

weight:
2950kg
Model:
YS-8500
Field of View:
130mmx130mm
Tube Voltage Range:
25-160KV
Resolution:
5.8Lp/mm
weight:
2950kg
Model:
YS-8500
Field of View:
130mmx130mm
Tube Voltage Range:
25-160KV
Resolution:
5.8Lp/mm
Universal X-Ray Inspection System,high Quality 3D Measurement and Non-destructive Analysis.
Universal X-Ray Inspection System
High Quality 3D Measurement and Non-destructive Analysis
Attribute Value
Weight 2950kg
Model YS-8500
Field of View 130mm x 130mm
Tube Voltage Range 25-160KV
Resolution 5.8Lp/mm
Product Introduction

The Universal X-Ray Inspection System, YS-8500, adopts COMET's open X-ray tube design with defect inspection capability reaching 0.5μm. It supports 2D/3D/CT inspection methods and is ideal for quality inspection, 3D measurement, and non-destructive analysis.

Application Advantages
  • Planar CT function (PCT) for 3D/CT inspection of printed circuit boards, SMT, IGBT, wafers, etc.
  • Cone beam CT function for inspection of sensors, relays, micro motors, materials, and aluminum castings
  • Convenient 360° fixed-point observation mode
  • 2D void inspection software module (optional)
  • 3D measurement and analysis software module (optional)
Application Fields
  • Soldering quality inspection of solder joints on PCB, BGA components, integrated circuits (IC) and their bond wires inspection, semiconductor package inspection and internal connection, electronic power (IGBT) module inspection, Wafer defect inspection (WLCSP)
  • Inspection of sensors, relays, fuses, coils, micro drive systems and air bag control systems, micro motors (MEMS, MOEMS), cables and plugs, plastic parts, various materials such as plastics, ceramics, biological materials, optical components, small titanium and aluminum castings
360° Rotating Observation Mode
360° rotating observation mode of YS-8500 X-Ray Inspection System
Product Parameters
Model No. YS-8500
X-Ray Tube Type Open Microfocus Transmitted Ray Source
Tube Voltage Range 25-160KV
Tube Current Range 0.01mA~1.0mA
Maximum Tube Power 64W
Maximum Target Power 10W
Micro Focus Size <1μm
Flat Panel Type Amorphous Silicon Flat Panel Detector (Optional)
Pixel Matrix 1536x1536
Field of View 130mmx130mm
Resolution 5.8Lp/mm
Image Frame Rate (1×1) 20fps
AD Conversion Digits 16bits
Maximum Sample Size 750mmx650mm
Maximum Inspection Area 550mmx550mm
Image Geometric Magnification 2000X
Input Power 220V 10A 50-60Hz
Operation System Precision T7920 Image Workstation
Dimensions L1600mm×W1700mm×H2000mm
Net Weight About 2950 KG