China YUSH Electronic Technology Co.,Ltd Company News

The SMT wave soldering process mainly consists of three stages: preheating, wave soldering and cooling. The specific process includes key steps such as fixture installation, soldering agent application, and double-wave soldering. SMT wave soldering is a key process in surface mount technology (SMT) used for welding surface-mounted components (THT) or mixed-assembly circuit boards. Its core lies in achieving batch welding through the wave of molten solder. The main process is as follows: 1‌.Fixture installation‌.Fix the printed board with components installed on it on a dedicated fixture to prevent the substrate from deforming due to heat and prevent solder spatter, ensuring welding stability.‌‌ ‌2.Spraying flux‌.Uniformly apply flux to remove oxides on the surface of the pads and component pins to prevent secondary oxidation during the welding process. The type of flux needs to be selected based on the PCB material and component density.‌ 3.Preheating. Temperature control: The preheating temperature is usually 90 to 130℃. For multi-layer boards or high-density surface mount boards, the upper limit (115 to 125℃) should be adopted. Function: Activates the flux, reduces thermal shock, and prevents tin splashing during welding due to solvent evaporation. 4.Wave soldering. Double peak structure: The first peak (disordered wave) ensures that the solder fully penetrates the solder joints, while the second peak (wide flat wave) eliminates bridging and tip pulling defects. Parameter Settings: The temperature of the soldering furnace is usually 245 ± 5℃, and the welding time is 3 to 5 seconds. If it lasts too long, it may damage the substrate. 5.Cooling.Quick cooling is used to enhance the strength of solder joints, usually through air cooling or water cooling methods. The cooling rate must be controlled to avoid thermal stress cracks. Process Variants and Optimization 1.Slope Peak Soldering: The conveying guide rail is designed in a slope shape, which prolongs the immersion time of the solder joints, improves efficiency and reduces air entrapment at the solder joints. 2.High Peak Soldering: Suitable for long-leg surface mount welding processes. Used in conjunction with a foot-cutting machine, the nozzle height can be adjusted. 3.Online process: Integrates post-processing steps such as cutting and cleaning, suitable for automated production lines.

Automatic Board Splitting Machine: A Key Role in Intelligent Manufacturing In modern electronic manufacturing, the automatic board splitting machine has become a crucial equipment for enhancing production efficiency and product quality. As an important component of intelligent manufacturing, the fully automatic board separation machine, with its automation and high precision features, has significantly enhanced the manufacturing level of electronic products. YUSH Electronic Technology Co., Ltd continuously innovates in this field and provides high-quality intelligent manufacturing solutions, offering strong support to customers in the market competition. What is a fully automatic board splitting machine?A fully automatic board splitting machine is a high-tech equipment specially designed for the electronic manufacturing industry. It is mainly used to cut large-sized PCB boards (printed circuit boards) into smaller units. During the manufacturing process, the fully automatic board splitting machine not only enhanced production efficiency, but also significantly improved product quality and consistency. The types and application scenarios of the fully automatic board splitting machine include: 1.Router machine for board separation: Using a high-speed rotating milling cutter for cutting, it is suitable for various materials and the cutting accuracy can reach ±0.05mm.It is widely used in PCB boards of different thicknesses and materials. 2. Laser-based board separation machine: Renowned for its high precision and non-contact cutting, it is suitable for PCB boards with extremely high precision requirements.According to market analysis, the application growth rate of laser board splitting machines in precision electronic products exceeds 15% annually (Market Insights, 2023). 3. PCB / FPC Punching Machine: Through mechanical pressure, linear cutting is achieved, which is suitable for standardized PCB boards in mass production and has a fast production speed.  4. V-CUT Board Cutting Machine: The separation is achieved by using the V-shaped grooves pre-designed on the PCB, which is fast and efficient and suitable for various batch productions. How does the fully automatic board splitting machine complete the board splitting process?  The working principle of the fully automatic board splitting machine is based on the cutting techniques of different types of equipment.  1.The router machine uses a high-speed rotating milling cutter to cut PCB boards, and is suitable for multi-layer boards and applications with different materials.  2.The laser-based board separation machine uses a laser beam for precise cutting, reducing the impact of mechanical stress on the PCB board. It is particularly suitable for brittle materials and high-density circuits.  3.The PCB / FPC Punching Machine uses mechanical pressure for cutting and is suitable for the production of standardized PCB boards in large quantities. 4.The V-CUT board separation machine uses pre-cut V-shaped grooves for separation, which is fast and efficient. The combination of SMT surface mount technology assembly and board separation machine During the SMT (Surface Mount Technology) assembly process, the fully automatic board splitting machine plays a crucial role.Through efficient cutting technology, the panel separator provides precise PCB board units for SMT processing, ensuring the smooth progress of the  process.YUSH's specialized solutions help customers achieve higher production efficiency and product quality in SMT processing.

SMT (Surface Mount Technology) automatic feeding is a core process in electronic manufacturing, and its accuracy and efficiency directly affect product performance. The traditional feeding methods are mainly manual or semi-mechanical, which are difficult to meet the requirements of high-density and miniaturized component mounting. The automatic feeding technology based on machine vision, with visual alignment and visual guidance as the core, combined with a convenient operation interface, is becoming the key technology for the upgrade of SMT. SMT Loading Method: Manual component placement: The operator manually places the components onto the tape or tray. This method is inefficient and prone to positional errors due to fatigue. For components with a spacing of less than 0.3mm, the misalignment rate can reach as high as 5%. 2. Belt conveyor line: Continuous supply of components is achieved through belt transmission, but the positioning accuracy is low (with an error of more than ±1mm), and additional correction stations need to be added, occupying production line space. 3. Tape feeding: High-precision electric structure, capable of handling tapes ranging from 8mm to 52mm. Achieves millimeter-level feeding accuracy through visual recognition of positioning holes. 4. Tray feeding: For IC components (such as BGA and QFP), the vision system locates the positions of the components within the tray, guiding the robotic arm to accurately pick them up, with the error controlled within ±0.05mm. 5. Flexible feeding: The flexible vibrating disc works in conjunction with vision, capable of accommodating irregular and tiny components (such as medical rubber bands), with a compatibility rate of 99%, and supporting rapid model changes. The core challenge in SMT component loading lies in the high-precision alignment of components and pads. Traditional mechanical positioning relies on fixed fixtures, and when dealing with irregular-shaped components or those with small pitch, the error rate significantly increases. The machine vision-driven SMT automatic feeding technology breaks through the limitations of traditional manual and mechanical methods, achieving ±0.03mm ultra-high precision alignment, and is compatible with irregular components and rapid model changes. It has become the core engine for the intelligent upgrade of electronic manufacturing.

The Vietnam Electronics Exhibition (NEPCONVetnam) is the only exhibition in Vietnam dedicated to the electronic manufacturing industry, including SMT, testing technologies, equipment and support services. It is the most influential and unique electronics trade fair in Vietnam, serving as a testing ground for the latest technologies and global innovators. It holds significant importance for the rapid development of the manufacturing industry in Vietnam, which is one of the next major electronic manufacturing centers in the world. With the emergence of many international giants, the Vietnamese electronics industry is rising as a new center for electronic manufacturing. It provides numerous opportunities for electronic manufacturers to connect with each other, update the hottest trends through on-site forums and conferences, showcase technologies and solutions, and unleash the potential of enterprises.It is an important platform for manufacturers in the Chinese electronics manufacturing industry to explore the Vietnamese and even ASEAN markets. By participating in this exhibition, our company can have face-to-face communication with customers, which will enable us to achieve cooperation more effectively. At the same time, we can have in-depth discussions with experts to innovate and improve our products. This also helps us understand the new development trends of the industry and the status of our competitors. It is also beneficial for expanding the company's sales and business scope, launching new products, and enhancing the international reputation of our products.