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Home > products > Dip Line Machine > M Selective Soldering System
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M Selective Soldering System

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M Selective Soldering System

Model MPF4/46 Spray molding machine MPF4/41 Spray molding machine MPF4/46 Welding module machine MPF4/41 Welding module machine
Equipment parameter
Dimension
(L*W*H)
950*1845*1571mm 1100*2045*1571mm 1700*1845*1571mm 2000*2045*1571mm
Transport parameter Transport width adjustment 50-460mm 50-610mm 50-460mm 50-610mm
PCB size 510*460mm 610*610mm 510*460mm 610*610mm
Conveyor height 900±20(mm)
The Soldering system Solder pot Electromagnetic pump tin solder pot
N2 consumption 0.5KG/pot/week*1
Solder pot numbers Single pot/Dual pots/Dual pots individual control

M Selective Soldering System 0


Single pot Dual pots Dual pots individual control