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Home > products > Dip Line Machine > H Selective Soldering System
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H Selective Soldering System

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H Selective Soldering System

Model HPS4/35 /HPS4/61 HPS4/35S
Equipment parameter Dimension(L*W*H) 2450*1845*1571mm/2900*2045*1571mm 2450*2055*1571mm
Transport parameter Transport width adjustment 50-460mm/50-610mm 50-350mm
PCB size 510*460mm/610*610mm 510*350mm
Conveyor height 900±20(mm)
Soldering system Solder pot Electromagnetic pump solder pot
N2 consumption 1.5-2m³/h/potx1
Solder pot numbers Single track single pot/double pots Dual tracks dual pots
Module numbers One/Two/Three modules

H Selective Soldering System 0


Single Pot Dual Pots Dual Pots Individual Control