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Home > products > Dip Line Machine > H Selective Soldering System
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H Selective Soldering System

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H Selective Soldering System

Model HPS5/55
Equipment parameter Dimension(L*W*H) 4200*1915*1571mm
Transport parameter Transport width adjustment 50-510mm
PCB size 510*510mm
Conveyor height 900±20(mm)
Soldering system Solder pot Electromagnetic pump solder pot
N2 consumption 1.5-2m³/h/potx1
Solder pot numbers Single track single pot/double pots
Module numbers One/Two/Three modules

H Selective Soldering System 0


Single pot Daul pots Daul pots individual Control