unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along

the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer

alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and

illumination for fine pitch application.
10.Full microprocessor logic control.

Parameters:

Model: YSHP-1A

Size: 500mm X 750mm X 910mm

Work Air Pressure: 0.5-0.7MPA

Working Area: 110mm X 150mm

Temperature setup: 0-400℃

Tolerance of Temp: +2℃

Time of pressing: 0-99s

Tolerance of Pressing: 0.05MPA

Description:

Hot bar soldering is extremely effective in bonding components and parts

that are dissimilar and difficult to unite. Several examples are listed above,

but there are many other soldering situations that call hot bar reflow soldering

system. This technology, also known as pulse bonding, differs from traditional

soldering since the reflow process uses thermode technology, which is based

on rapid reflow by pulse heating. This procedure allows materials with low

temperature resistance to be soldered at high lead-free temperatures without

damage to the flex. It selectively solders parts by heating them to a temperature

that's high enough to cause their adhesive or solder to melt and then re-solidify

to form a permanent bond.

FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse Heat 4

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FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine with Pulse Heat

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