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Home > products > Vision Inspection System > Inline High-speed Real-time Inspection Series/YS-8500 For SMT Production Line
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Inline High-speed Real-time Inspection Series/YS-8500 For SMT Production Line

Product Details

Place of Origin: China

Brand Name: YUSH

Certification: CE, RUV Rheinland (China), GMC(GlobalMarket),ISO9001-2000

Model Number: ys-8500

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: USD25000

Packaging Details: woodencase

Delivery Time: 8

Payment Terms: L/C,D/A,D/P,T/T

Supply Ability: 100SETS

Get Best Price
Highlight:

Inline high-speed X-ray inspection

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SMT production line inspection

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Real-time automatic X-ray inspection

×-Ray Tube Type:
Open Microfocus Transmitted Ray Source
Tube Voltage Range:
25-160KV
Tube Current Range:
0.01mA~ 1.0mA
Maximum Tube Power:
64W
MaximumTarget Power:
10W
×-Ray Tube Type:
Open Microfocus Transmitted Ray Source
Tube Voltage Range:
25-160KV
Tube Current Range:
0.01mA~ 1.0mA
Maximum Tube Power:
64W
MaximumTarget Power:
10W
Inline High-speed Real-time Inspection Series/YS-8500 For SMT Production Line
Inline High-speed Real-time Inspection Series/YS-8500 For SMT Production Line
Product Specifications
Attribute Value
X-Ray Tube Type Open Microfocus Transmitted Ray Source
Tube Voltage Range 25-160KV
Tube Current Range 0.01mA~ 1.0mA
Maximum Tube Power 64W
Maximum Target Power 10W
Application Advantages
  • With planar CT function (PCT), it can be applied to 3D/CT inspection of printed circuit boards, SMT, IGBT, wafers, etc.
  • With cone beam CT function, it can be applied to the inspection of sensors, relays, micro motors, materials, and aluminum castings
  • Convenient 360° fixed-point observation mode
  • 2D void inspection software module (optional)
  • 3D measurement and analysis software module (optional)
Application Fields
  • Soldering quality inspection of solder joints on PCB, BGA components, integrated circuits (IC) and their bond wires inspection, semiconductor package inspection and internal connection, electronic power (IGBT) module inspection, Wafer defect inspection (WLCSP)
  • Inspection of sensors, relays, fuses, coils, micro drive systems and air bag control systems, micro motors (MEMS, MOEMS), cables and plugs, plastic parts, various materials such as plastics, ceramics, biological materials, optical components, small titanium and aluminum castings
360° Rotating Observation Mode
YS-8500 360° rotating observation mode demonstration
Technical Parameters
X-Ray Tube
X-Ray Tube Type Open Microfocus Transmitted Ray Source
Tube Voltage Range 25-160KV
Tube Current Range 0.01mA~ 1.0mA
Maximum Tube Power 64W
Maximum Target Power 10W
Micro Focus Size <1μm
Flat Panel Detector
Flat Panel Type Amorphous Silicon Flat Panel Detector
Pixel Matrix 1536x1536
Field of View 130mmx130mm
Resolution 5.8Lp/mm
Image Frame Rate (1×1) 20fps
AD Conversion Digits 16bits
Equipment Specifications
Maximum Sample Size 750mmx650mm
Maximum Inspection Area 550mmx550mm
Image Geometric Magnification 2000X
Input Power 220V 10A 50-60Hz
Operation System DEL Precision T7920 Image Workstation
Dimensions L1600mm×W1700mm×H2000mm
Net Weight About 2950 KG