Product Details
Place of Origin: GUANGDONG
Brand Name: YUSH
Certification: CE
Model Number: SM485
Payment & Shipping Terms
Minimum Order Quantity: 1
Price: USD 78000
Packaging Details: Wooden case
Delivery Time: 20 WORK DAYS
Payment Terms: L/C,D/A,D/P,T/T
Supply Ability: 1000
4+1 Spindle Configuration: |
Combines Four High-speed Spindles And One High-precision Spindle For Flexible Component Placement. |
Wide Component Compatibility: |
Handles Small Chips, ICs, Irregular-shaped Components, Insertion-type Components And Large Connectors. |
High Placement Accuracy: |
Provides ±40 μm Chip Accuracy And ±30 μm QFP Accuracy At ±3σ. |
Advanced Vision Recognition: |
Fly Camera And Fix Camera Systems Support Different Component Recognition Requirements. |
Multiple Lighting Options: |
Backlight And Laser Lighting Options Help Improve The Identification Of Complex Component Shapes And Leads. |
Flexible Placement Control: |
Vacuum And Pressure Control Functions Support Different Component Placement Requirements. |
Large Component Handling: |
Supports Components Up To 55 Mm And Connectors Up To 150 Mm In Length Under Specified Configurations. |
4+1 Spindle Configuration: |
Combines Four High-speed Spindles And One High-precision Spindle For Flexible Component Placement. |
Wide Component Compatibility: |
Handles Small Chips, ICs, Irregular-shaped Components, Insertion-type Components And Large Connectors. |
High Placement Accuracy: |
Provides ±40 μm Chip Accuracy And ±30 μm QFP Accuracy At ±3σ. |
Advanced Vision Recognition: |
Fly Camera And Fix Camera Systems Support Different Component Recognition Requirements. |
Multiple Lighting Options: |
Backlight And Laser Lighting Options Help Improve The Identification Of Complex Component Shapes And Leads. |
Flexible Placement Control: |
Vacuum And Pressure Control Functions Support Different Component Placement Requirements. |
Large Component Handling: |
Supports Components Up To 55 Mm And Connectors Up To 150 Mm In Length Under Specified Configurations. |
The SM485 is a professional hybrid SMT placement machine developed for high-mix PCB production, integrating standard chip mounting and odd-form insertion component mounting in a single platform. Built on a single-gantry structure with 4 high-speed spindles plus 1 high-precision spindle, it features a built-in pressure control module and backlight vision system.
This all-in-one solution eliminates the need for separate odd-form equipment. It completes the placement of tiny SMD chips, ICs, shield cans, bare chips and long insertion connectors on the same production line, significantly reducing factory space requirements and capital investment for EMS manufacturers.
The Fly Camera handles fast identification and placement of small chips and regular SMD components, while the Fix Camera is dedicated to large ICs, shield cans and ultra-long connectors. This dual-camera matching system balances placement speed with recognition stability, effectively solving identification challenges for reflective, irregular and tall special components.
The Z-axis of the precision spindle supports real-time placement pressure adjustment. For fragile bare chips and easily deformed through-hole insertion components, it prevents component cracking, pin bending or PCB damage caused by excessive placement force, ensuring a stable mounting yield.
Standard backlight module: excellent for highly reflective shield cans, identifying component outlines through shadow imaging. Optional laser lighting module: clearly recognizes the pins of narrow-pitch insertion connectors, reducing missing identification and misplacement rates for complex odd-form parts.
It covers ultra-small 0402 chips, regular ICs up to ∅55mm, shield cans, bare die, and long connectors from L75mm to L150mm. It is the ideal equipment for production lines with mixed SMT and PIP insertion processes.
Single-lane PCB transmission design, compatible with standard and extended large-size PCB options. Stable transmission with low jamming risk, suitable for medium-batch, high-variety electronic assembly.
| Spindle Configuration | 4 high-speed spindles + 1 high-precision spindle, 1 Gantry |
|---|---|
| Optimum Placement Speed | 22,000 CPH |
| Placement Accuracy | Chip: ±40μm@±3σ; IC: ±30μm@±3σ |
| Component Range (Fly Camera) | 0402 ~ ∅21mm, Max Height 15mm |
| Component Range (Fix Camera) | 0402 ~ ∅55mm, Max Height 26mm |
| Long Connector Range | L75mm ~ L150mm (MFOV) |
| PCB Size (Standard) | L460 × W400mm (Single Lane) |
| PCB Size (Optional) | L740 × W460mm (Single Lane) |
| PCB Thickness | 0.38 ~ 4.2 mm |
| Feeder Capacity | 120ea / 112ea (Docking Cart, 8mm feeder benchmark) |
| Power Supply | AC200 / 208 / 220 / 240 / 380 / 415V, 3 Phase, 50/60Hz, Max. 3.5kVA |
| Air Consumption | 180Nℓ/min, 50Nℓ/min for vacuum pump |
| Overall Weight | Approx. 1600 KG |
| External Dimension | L1650 × D1680 × H1530 mm |
The machine is packed in an export fumigated wooden case, with protective film applied to precision components. The unit is firmly fastened inside the case to prevent collision damage during sea or air transport.