Applications
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
• CCD automatic positioning and calibration.
• Real-time monitoring of the air pressure, water pressure, current and other values of the system to avoid spindle damage. • Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm) • Repeat positioning accuracy: 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Standard collocation blade: 2 Inch (Max: 3 Inch)

Semi-Dicing System Ceramic Plate Cutting Machine 0

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